Description
These thermal conductive pads by Delock can be used for heat dissipation of an M.2 module. They can be sticked e.g. between an M.2 SSD and a heat sink.
Specification
• Thermal pad for heat dissipation
• Thermal conductivity: 3.2 W/mK
• Colour: grey
• Dimensions (LxWxH): ca.
1) 70 x 20 x 1.75 mm
2) 70 x 20 x 0.75 mm
System requirements
• M.2 module
Package content
• 2 x thermal pad
