This thermal conductive pad by Delock is suitable for heat dissipation, for example, on an M.2 module. The goal of the pad is to improve performance and increase the service life of the components.
Specification• Thermal pad for heat dissipation
• Thermal conductivity: 3.0 W/mK
• Operating temperature: -60 °C ~ 180 °C
• Colour: grey
• Dimensions (LxWxH): ca. 120 x 20 x 1.5 mm
• 1 x thermal conductive pad
